ChEmpower abrasive-free planarization technology has secured $18.7 million in Series A funding. ChEmpower Corporation is a Propel(x) portfolio company focused on next-generation semiconductor manufacturing.
The Series A round was co-led by M Ventures and Rhapsody Venture Partners. Additional investors include Intel Corporation, Pangaea Ventures, Foothill Ventures, IQTT, and TEL Venture Capital.
What Is ChEmpower Abrasive-Free Planarization Technology?
Traditional chemical mechanical planarization (CMP) relies on abrasives. These abrasives can damage wafers. They also reduce yield and increase manufacturing costs.
ChEmpower abrasive-free planarization technology removes abrasives from the process. As a result, manufacturers achieve defect-free wafer surfaces and higher yields.
In addition, the technology improves sustainability. This matters because planarization accounts for nearly 40% of total fab water usage. ChEmpower enables significant water recovery during chip manufacturing.
Why This Matters
Demand for AI chips and sub-10nm semiconductor nodes is growing quickly. Therefore, manufacturers need more precise and efficient planarization methods. ChEmpower’s solution supports advanced packaging, AI hardware, and high-performance computing.
ChEmpower is redefining how advanced semiconductors are built. Its abrasive-free approach supports both performance and sustainability.
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